Conductive Technologies' family of RFI/ESD shielding products includes both discrete
"stand alone" shields and switch-integrated shields. Available in a wide choice of
materials, they may be configured as dictated by design requirements and in a wide
range of sizes. Conductive Technologies shielding structures avoid such problems of
many other shielding processes as pinholes, skips, voids, and air entrapment. Many are
designed to be folded, creased, and crimped to envelope individual circuits without
chipping or delaminating. This shielding process has been awarded a U.S. patent
#4,670,347 June 1987 (MSD 4).
Other types of shields are designed for shielding keyboards and entire frameworks in
the flat or "wall to wall" configurations.
Conductive Technologies shields attenuate both incoming and outgoing EMI as well as
grounding electrostatic discharge (ESD).
Our newest design is our formed ESD Shielding (MSD 8) which can be
formed to fit just about any type of custom configuration. Formed shields can be
provided with or without a laminated insulation layer and can be used as a "stand
alone" shield or molded into an injection molded enclosure to provide a "one-piece"
shielded box.
Conductive Technologies' family of RFI/ESD shielding products includes both discrete
"stand alone" shields and switch-integrated shields. Available in a wide choice of
materials, they may be configured as dictated by design requirements and in a wide
range of sizes. Conductive Technologies shielding structures avoid such problems of
many other shielding processes as pinholes, skips, voids, and air entrapment. Many are
designed to be folded, creased, and crimped to envelope individual circuits without
chipping or delaminating. This shielding process has been awarded a U.S. patent
#4,670,347 June 1987 (MSD 4).
Other types of shields are designed for shielding keyboards and entire frameworks in
the flat or "wall to wall" configurations.
