LASER ABLATION

CTI possesses the ability to create features into thin metal films using several methodologies including UV-laser ablation and CO₂ laser scribing. Both methodologies utilize sheet materials. For ablation, plastic sheets have been metalized by sputtering. For scribing either sputtered metals or printed inks on plastic can be used. Building in sheet form allows us to finish sensor fabrication by adding printed or other secondary features including reagents that are needed to complete functionality.

LASER SPECIFICATIONS

1.1

Critical Dimensions

Substrate Size: 22" x 22"
Ablation Area: 19" x 19"

1.2

Mask (Chrome Quartz Mask)

7" x 7" automatic alignment
Multiple images per mask

1.3

Laser Source

248 nm Excimer (KrF), Coherent LPX Pro 305
Maximum Pulse Energy: 1200 mJ
Maximum Rep Rate: 50 Hz
Pulse Width: 10-50 ns

1.4

Individual Image Specification

Maximum Field Size: 50 mm diameter at substrate plane
Resolution: 5 microns

Homogenizer Description	Image Size	Image Area	Laser Fluence
20mm x 75mm (.79" x 2.95")	8mm x 30mm 0.32" x 1.18")	2.4 cm² (0.37 in²)	Up to 150 mJ/cm²
28mm x 95mm (1.10" x 3.74")	11mm x 38mm (0.44" x 1.50")	4.2 cm² (0.65 in²)	Up to 100 mJ/cm²

1.5

Substrates

Film gauges up to 10-mil thickness
PET, Polyimide, Polycarbonate

1.6

Metalized Surfaces

Cu, Au, Pt, Pd, Al, Ti, Ni, Ag
Typical thicknesses up to 200 nm depending on material properties such absorptivity and reflectivity and image size
Film costs are dependent upon metal type and coat weight.

LASER SCRIBING SPECIFICATIONS

2.1

Critical Dimensions

Substrate Size: 26" x 38"
Scribing Area: 24" x 36"
Maximum Field of View: 12" x 12"
Accuracy: 0.05% of the FOV

2.2

Laser Source

CO₂ (continuous galvo)
Maximum Power: 100 and 200 watts
Beam Width: 0.006" - 0.008"

APPLICATIONS

3.1

IDE Circuits

Electrochemical Impedance Spectroscopy
Conductance Measurements

3.2

Working Electrodes

Amperometric Sensors
Potentiometric Sensors
Micro-arrays

3.3

Circuits

RFID Antenna
Heaters
Through Holes

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