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LASER ABLATION

Laser Ablation

CTI possesses the ability to create features into thin metal films using several methodologies including UV-laser ablation and CO2 laser scribing. Both methodologies utilize sheet materials. For ablation, plastic sheets have been metalized by sputtering. For scribing either sputtered metals or printed inks on plastic can be used. Building in sheet form allows us to finish sensor fabrication by adding printed or other secondary features including reagents that are needed to complete functionality.


LASER SPECIFICATIONS

1.1
Critical Dimensions

  • Substrate Size: 22" x 22"
  • Ablation Area: 19" x 19"
1.2
Mask (Chrome Quartz Mask)

  • 7" x 7" automatic alignment
  • Multiple images per mask
1.3
Laser Source

  • 248 nm Excimer (KrF), Coherent LPX Pro 305
  • Maximum Pulse Energy: 1200 mJ
  • Maximum Rep Rate: 50 Hz
  • Pulse Width: 10-50 ns
1.4
Individual Image Specification

  • Maximum Field Size: 50 mm diameter at substrate plane
  • Resolution: 5 microns

Homogenizer
Description
Image Size Image Area Laser Fluence
20mm x 75mm
(.79" x 2.95")
8mm x 30mm
0.32" x 1.18")
2.4 cm2
(0.37 in2)
Up to 150 mJ/cm2
28mm x 95mm
(1.10" x 3.74")
11mm x 38mm
(0.44" x 1.50")
4.2 cm2
(0.65 in2)
Up to 100 mJ/cm2


1.5
Substrates

  • Film gauges up to 10-mil thickness
  • PET, Polyimide, Polycarbonate
1.6
Metalized Surfaces

  • Cu, Au, Pt, Pd, Al, Ti, Ni, Ag
  • Typical thicknesses up to 200 nm depending on material properties such absorptivity and reflectivity and image size
  • Film costs are dependent upon metal type and coat weight.

LASER SCRIBING SPECIFICATIONS

2.1
Critical Dimensions

  • Substrate Size: 26" x 38"
  • Scribing Area: 24" x 36"
  • Maximum Field of View: 12" x 12"
  • Accuracy: 0.05% of the FOV
2.2
Laser Source

  • CO2 (continuous galvo)
  • Maximum Power: 100 and 200 watts
  • Beam Width: 0.006" - 0.008"

APPLICATIONS

3.1
IDE Circuits

  • Electrochemical Impedance Spectroscopy
  • Conductance Measurements
3.2
Working Electrodes

  • Amperometric Sensors
  • Potentiometric Sensors
  • Micro-arrays
3.3
Circuits

  • RFID Antenna
  • Heaters
  • Through Holes

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